氮化铝颗粒增强聚合物基板材料的制备及介电性能研究

Fabrication and Dielectric Property of Polymer-Matrix Composites Containing AlN Particles for Electronic Substrates

采用氮化铝(A lN)颗粒作为增强材料,以环氧树脂(E-51)为聚合物基体,制备了陶瓷颗粒/聚合物复合电子封装与基板材料。对该复合材料的成型工艺、介电性能和导热性能进行了系统的研究。随着陶瓷颗粒增强材料含量的增加,复合材料的导热性能得到改善。在加入了陶瓷颗粒增加了复合材料导热性的同时,仍维持了聚合物材料低介电常数的优点。

The fabrication processing,dielectric properties and thermal properties of polymer-matrix composites containing AlN particles for electronic substrates and microelectronic packaging applications are investigated.The epoxy resin is used as the polymer matrix in the composites.The properties of the composites are measured in the range of AlN contents changing from 0.00 to 30vol%.With increasing the content of AlN particles,thermal conducting of composites is improved,while the composites still keep the relati...