固体继电器受热载荷作用的数值模拟分析

Numerical Simulation Analysis of Solid State Relay Subjected to Thermal Loading

针对固体继电器受热问题,基于热弹性力学理论建立了三维有限元数值模拟分析模型。研究了固体继电器在功率耗散情况下,受热载荷作用时的温度分布和热应力分布,并通过对不同参数下温度和热应力的模拟,初步分析了影响固体继电器热性能的各设计因素。所得的计算结果可为产品的改进提供依据。

Based on the theory of thermo-elasticity mechanics, the 3-D finite element numerical simulation model was established for a solid state relay (SSR) subjected to thermal loading. The distribution of temperature and thermal-stress under power dissipation using thermal loading were studied, and every factor that influences the thermal function of SSR was preliminarily analyzed by simulating the temperature and thermal-stress under different parameters. The result can provide basis for the improvement of this p...