摘要
应用BGS 6341型电子薄膜应力分布测试仪,对硅薄膜翘曲度及应力进行了测试,结合生产工艺对其测试结果加以分析,找出应力产生的各种因素,并加以改进,有效地提升工艺生产水平及稳定性。
Stress distribution and warping degree of Si-SiO2 thin films were tested with BGS 6341 test system. Analysis on the test results are made in combination with the production process. The causes of the stress were found and improved, which have effectively upgraded the process and stability.
出处
《半导体光电》
CAS
CSCD
北大核心
2003年第3期209-211,共3页
Semiconductor Optoelectronics
关键词
错位相移
薄膜
翘曲度
应力
dislocation phase shift
thin film
warping degree
stress
