摘要
研究了芯片封装中键合线的建模和模型参数提取方法。根据二端口网络参量,提出了单键合线的"型等效电路并提取了模型中的R、L和C参量。最后,设计出一个简单、低成本的测试结构验证了仿真分析结果。
The objective of this paper was to present a preparatory investigation of modeling of IC packages for chip-package co-design. The work was focused on the modeling and parameter extraction methods of bond-wires. Based on two-port parameters, a lumped Ⅱ-type equivalent circuit for a single-bond-wire was presented and the R, L, and C parameters of the bond-wire were extracted. Finally, a simple and low cost test structure was designed and made for validation of the parameterized model.
出处
《中国集成电路》
2006年第11期55-57,60,共4页
China lntegrated Circuit
基金
江苏省高新技术资助项目(BG2005022)
南通大学自然科学基金资助项目(05Z115)
关键词
封装
键合线
建模
参数提取
去嵌入
Package
Bond-wire
Modeling
Parameter extraction
De-embedding
