1Bustillo J M, Howe R T, Muller R S. Surface micromachining for microelectromechanical system [J]. Proc the IEEE, 1998; 86(10): 1552-1573.
2Szkody R. Integrated sensor system demonstration results [A]. Proc 18th Digital Avionics Systems Conf [C]. 1999. 3B 3-1 - 3B 3-8.
3Hosticka B J. CMOS sensor systems[J]. Sensors and Actuators, 1998, A66(2) : 335-341.
4Mason A,wirelessYazdi N, Najafi K, et al. A low-power wireless microinstrumentation system for environmental monitoring [ A ] . Transducers'95, Eurosensors [C]. Stockholm, Sweden. 1995. 107-110.
5Wise K D . Integrated microsystems : merging MEMS, micropower electronics, and wireless communications [A]. 12th ASIC/SOC Conf [C]. 1999. xxiii-xxix.
6Yoshii Y, Nakajo A, Abe H, et al. 1 Chip integrated sohware calibrated CMOS pressure sensor whh MCU, A/D converter, D/A converter, digital communication port, signal conditioning circuit and temperature sensor [A]. 1997 Int Conf Sol Sm Sensors and Actuators [C]. Chicago, USA. 1997. 1485-1488.
7Singh R. An intelligent system for odor discrimination [A]. Proc Electronic Design, Test and Applications [C]. 2002. 489-491.
8Sun J-W, Shida K. Multi-layer sensing approach for environmental perception via a multi-functional sensor [A]. SICE [C]. Lizuka, 2000. 241-246.
9Tian G-Y. Design and implementation of distributed measurement systems using fieldbus-based intelligent sensors [J]. IEEE Trans Instrumentation and Measurement, 2001, 50 (5) : 1197-1202.
10Agre J, Clare L. An integrated architecture for cooperative sensing networks [J]. Computer, 2000, 33(1): 106-108.