微观粘着测试技术研究进展

Progress of Micro Adhesion Testing Technology

微构件粘附是造成微机电系统(MEMS)失效的主要原因,也是导致MEMS性能不稳定难以走向市场的关键所在。因此,对于MEMS粘着问题的研究,微观粘着测试技术显得极为重要。综述了国内外微观粘着测试技术的研究进展和现状,介绍了基于应变片、光学检测、电容式传感器、压电式力传感器和分析天平等原理的粘着测试装置,分析了它们的工作原理和特点。

The failure of micro-electromechanical system(MEMS) is mainly due to the stiction of micro cantilever which becomes the key factor for the MEMS to improve capability.Therefore,it’s very important of micro adhesion testing technology in studying adhesion problem of MEMS.The progress and actuality of researching micro adhesion testing technology was summed up,and some adhesion testing devices based on strain gauge,optical measurement,pressure sensor,capacitive force sensor,piezo force sensor,analytical balanc...