复合型裂纹扩展过程的温度场分析

Temperature Field Analysis of Mixed Mode Crack During Propagation

针对实际工程结构中广泛存在的Ⅰ-Ⅱ复合型裂纹,以有限元软件ANSYS为平台,采用能量释放率准则作为判定依据,模拟了复合型裂纹的扩展路径;将裂纹扩展过程中裂尖前面耗散的塑性功视为内热源,采用热-力耦合方法,分析了扩展过程中的裂尖温度场变化,讨论了预制裂纹角对裂尖起裂塑性区和起裂温度的影响。通过与红外热像仪记录的实验结果进行对比,发现有限元模拟结果与实验结果一致。

Ⅰ-Ⅱ mixed-mode fractures of material in practical engineering were considered.Using ANSYS software,the energy release rate was used as the fracture criterion to infer the propagation path of compound crack;regarding the plastic work dissipated ahead of the running crack as inner heat source,the crack tip temperature field was simulated by performing coupled thermal-mechanical finite element analysis.The influence of prefabricated crack angle on crack tip initiation plastic zone and crack initiation temperat...