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4H-SiC欧姆接触与测试方法研究 被引量:5

4H-SiC Ohmic Contact and Measure Technology
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摘要 主要针对不同金属和工艺条件下的4H-SiC欧姆接触特性进行对比研究,形成4H-SiC的优良欧姆接触的最佳条件。通过TLM方法结合四探针测量得到特征接触电阻率,测得NiCr和Ni与4H-SiC的最佳特征接触电阻率分别达到ρc=9.02×10-6Ω.cm2,ρc=2.22×10-7Ω.cm2,能够很好满足SiC器件的需要。 In this paper,the characteristics of the 4H-SiC ohmic contact for different metals and process conditions were studied.The best condition for ohmic contact process was obtained,which is the base of the fabrication of the SiC devices.The process flow chart of ohmic contact was also introduced,the specific contact resistivity with TLM and Four-Probe measure was obtained.The best results for specific ohmic contact respectively are ρc=9.02×10-6 Ω·cm2 for NiCr/SiC and ρc=2.22×10-7 Ω·cm2 for Ni/SiC resistivity.
出处 《固体电子学研究与进展》 CAS CSCD 北大核心 2008年第1期38-41,共4页 Research & Progress of SSE
基金 国家重点基础研究发展规划(2006CB604900) 国家高技术研究发展规划(2006AA03A103 2006AA03A142) 国家自然科学基金(6039072 60421003 60676057) 高等学校博士学科点专项科研基金(20050284004) 江苏省自然科学基金项目(BK2005210) 单片集成电路与模块国家级重点实验室2006年度基金(9140C1404010605)
关键词 碳化硅 欧姆接触 特征接触电阻率 退火 SiC ohmic contact specific contact resistivity annealing
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参考文献5

  • 1[1]Nieberding W C,Powell J A.High temperature electronic requirements in aeropropulsion systems[J].IEEE Trans on industrial Electronics,1982,29:103-106.
  • 2[2]Charles E Weitzel,John W Palmour,Calvin H Carter,et al.4H-SiC MESFET with 2.8 W/mm power density at 1.8 GHz[J].IEEE Electron Device Letters,1994,15(10):406-407.
  • 3[3]Nisson P A,Saroukhan A M,Svedberg J O,et al.Characterization of SiC MESFETs on conducting substrates[C].Materials Science Forum,2000:338-342,1255-1258.
  • 4[4]Chen G.Study of the n-type 4H-SiC ohmic contact[J].Chinese Journal of Semiconductors,Supplement 2005,26(6):273-276.
  • 5[5]Han R,Yang Y T,Wang P,et al.Ohmic contact properties of multi-metal films on n-type 4H-SiC[J].Chinese Journal of Semiconductors,2007,28(2):149-153.

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