微波多芯片组件中互连的研究方法导引
摘要
随着多芯片组件密度的不断提高,微波互连的不连续性成为制约其整体性能的瓶颈。本文简要回顾了微波电路的发展历程,介绍了几种流行的互连技术,重点分析了通孔互连的分析方法。
出处
《甘肃高师学报》
2006年第5期11-13,共3页
Journal of Gansu Normal Colleges
基金
甘肃省自然科学基金(3ZS061-A25-058)
甘肃省高等学校研究生导师科研项目计划(0511-02)
参考文献18
-
1顾墨琳,林守远.微波集成电路技术—回顾与展望[J].微波学报,2000,16(3):278-290. 被引量:24
-
2[2]Said F.Al-sarawi,Derek Abbott,and Paul D.Franzon,"A review of 3-D packaging'Technology,"IEEE Trans.Components,Packaging,and Manufacturing echnology-Part B,vol.21,no.1,pp.2~14,1998.
-
3[3]Geert J.Carchon,Dominique M.M.-P.Schreurs,et al.,"A direct Ku-Band linear subharmonically pumped BPSK and I/Q vector modulator in multilayer thin-film MCM-D,"IEEE Trans.Microwave Theory Tech.,vol.49,no.8,pp.1374~1381,2001.
-
4[6]Robert H.Havemann,James A.Hutchby,"Highperformance interconnects:An Integration overview," Proceedings of the IEEE,vol.89,no.5,pp.586~601,2001.
-
5[7]Albert E.Ruehli,Andrcas C.Cangellaris,"Progress in the methodologies for the electrical modeling of interconnects and electronic packages," Proceedings of the IEEE,vol.89,no.5,pp.740~771,2001.
-
6[8]Edward Pillai,Werner Wiesbeck,"Derivation of equivalent circuits for multilayer printed circuit board discontinuities using full wave models",IEEE Trans.Microwave Theory Tech.,vol.42,no.9,pp.1774~1782,1994.
-
7[9]Daniela Staiculescu,et al.,"Design rule development for microwave flip -chip applications,"IEEE trans.Microwave Theory Tech.,vol.48,no.9,pp.1476~1481,2000.
-
8[10]Ryosuke Ito,Robert W.Jackson and Thongchai Hongsmatip,"Modeling of interconnections and isolation within a multilayered ball grid array package," IEEE trans.Microwavc Theory Tech.,vol.47,no.9,pp.1819~1825,1999.
-
9[11]Anh-Vu H.Pham,Joy Laskar,et al.,"Ultra low loss millimeter wave multichip module interconnects," IEEE Trans.Components,Packaging,and Manufacturing Technology,vol.21,no.3,pp.302~308,1998.
-
10[12]T.Y.Wang,R.F.Harrington,and J.R.Mautz,"Quasi-static analysis of a microstrip via through a hole in a ground plane," IEEE Trans.Microwave Theory Tech.,vol.36,no.6,pp.1008~1013,1988.
二级参考文献15
-
1Chiao J,IEEEMTTS Dig,1999年,463页
-
2Chen Y C,IEEE Microwave Guided Wave Lett,1998年,8卷,11期,399页
-
3Lai R,IEEE Microwave Guided Wave Lett,1998年,8卷,11期,393页
-
4顾墨琳,现代雷达,1991年,13卷,5期,70页
-
5Liu Dongtian,IEEEMTTS Dig,1986年,265页
-
6Said F.AI-sarawi,Derek Abbort,et al.A review of 3-D packaging technology.IEEE Transactions on Components,Packaging,and Manufacturing Technology,1998,21(1):1-14
-
7Chalmers M Butler ,Talya L Keshavamurthy.Investigation of a radial,parallel-plate waveguide with an annular slot.Radio Science,1981,16(2):159-168
-
8Anh-Vu H Pham,Joy Laskar,et al.Ultra low loss millimeter wave multichip module inteconnects.IEEE Transations on Components,Packaging,and Manufacturing Technology,1998,21(3):302-308
-
9Hsu Show-Gwo,Wu Ruey-beei.Full wave characterization of a through hole via using the matrix-penciled moment method.IEEE Trans on Microwave Theory Tech,1994,42(8):1540-1547
-
10Mei K K.On the integral equations of thin wire antennas.IEEE Trans on Antanna Propagation,1965,13:374-378
共引文献30
-
1张博,张勇.5-18GHz功率放大模块研制[J].微波学报,2020,36(S01):175-178.
-
2周志鹏,杜小辉,代合鹏.GaAs单片移相器设计[J].微波学报,2005,21(4):54-57. 被引量:5
-
3姬五胜,肖建康,熊旭军.微波多芯片组件中垂直通孔互连的矩阵束矩量法仿真[J].微波学报,2005,21(6):23-26. 被引量:6
-
4向兵,成强,魏艳华,杨毅.基于模糊神经网络的微波器件建模[J].半导体技术,2006,31(10):762-765.
-
5姬五胜,谢拥军.微波多芯片组件中垂直通孔互连的研究进展[J].电子元件与材料,2007,26(3):1-4. 被引量:2
-
6杨自强,杨涛,刘宇.Ka频段单片低噪声放大器设计[J].微波学报,2007,23(3):39-42. 被引量:4
-
7李丽,廖海洲.基于Ansoft Designer的射频功放电路阻抗匹配优化设计[J].电子技术应用,2008,34(12):138-139. 被引量:4
-
8李海良,朱文学,童玲,田雨.微波电路通孔结构的改进型矩阵束矩量法仿真[J].微波学报,2011,27(3):66-69.
-
9李力,年夫顺.微波多层印制板带通滤波器[J].国外电子测量技术,2013,32(4):63-65. 被引量:10
-
10林守远,顾墨琳.微机电系统的微波应用[J].微波学报,2000,16(4):415-422. 被引量:5
-
1姬五胜,谢拥军.微波多芯片组件中垂直通孔互连的研究进展[J].电子元件与材料,2007,26(3):1-4. 被引量:2
-
2徐自强,张宝,徐美娟,廖家轩.基于低温共烧陶瓷技术的SIP工艺研究[J].稀有金属材料与工程,2013,42(S1):68-71.
-
3周骏,窦文斌,沈亚,李辉.应用SIP技术的宽带板间垂直互连结构[J].固体电子学研究与进展,2012,32(1):36-39. 被引量:8