激光切割技术在封装去除中的应用

Application of laser cutting technology in wiping off encapsulation

本文研究了一种用于去除封装材料的数控精密激光切割技术。利用成熟的激光切割技术,采用智能化控制,不仅可以对带器件PCB电路板、模块、芯片等器件的封装材料进行切割,实现剥离去除,且没有任何损伤;还能实现对沥青、树脂、陶瓷类保护层等多种材料的切割;实现切割精度高,并且可以实现微量切割。

The paper puts forward a kin of numerical controlled laser cutting technique applied to wipe off encapsulation of chip. Using laser cutting technique with intelligent control, encapsulation of PCB with module or chips can be cut by layer without any harm. Other protecting materials such as asphalt, colophony, ceramics can also be cut. Laser cutting reaches high precision, and can realize tiny cutting.