射频无线应用的体连接和图形化SOI LDMOSFET的比较
Comparison of Body-Contact and Patterned-SOI LDMOSFETs for RF Wireless Applications
摘要
设计并制作了一种可应用于无线通信放大器的新型的图形化SOI LDMOSFET.该器件沟道下方的埋氧层是断开的.测试表明,输出特性曲线没有发现明显的翘曲效应,关态的击穿电压达13V,在VG=4V和VD=3.6V时fT为8GHz,直流和射频性能均优于同一芯片上相同工艺条件制备的体接触LDMOSFET.
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