微电子器件散热控制及设计的一个理论模型

A Theoretical Model for Control and Design of Heat Dissipation in Micro-electronic Equipment

在微电子工业中,广泛运用多孔介质表面被强化微电子器件的相变散热,特别是强化提高其临界热负荷的值。针对多孔介质表面的沸腾,提出了新的多孔介质临界热负荷模型,理论上解析了表面多孔参数对临界热负荷的影响,理论模型与实验结果吻合得很好。研究无疑对电子安全系统技术、安全控制技术和设计技术有重要指导意义。

Porous media has been widely applied to enhance boiling heat transfer in industry, especially for increasing the value of CHF (critical heat flux). New critical heat flux model for boiling on porous coatings was proposed based on the analysis of liquid film stability. Parametric effect of porous coatings on CHF was elaborated. The analytical model is in good agreement with experimental results.