2Willimaa A S, et al.Tantalum availability - 2000 and beyond[J]. TIC, 2002, 110(2):3.
3Mosheim C E. Niobium and tantalum: a review of industry statistics[J] .TIC, 2001,108(4) :5.
4Mosheim C E.Tantalum and niobium: a review of industry tatistics[J] .TIC, 2002,112(4) :5.
5Rotter C L.Tantalum demand return seen [ J ].AMM, 2002,110.(1):5.
6Laurila T, et al. Chemical stability of tantalum diffusion barriers between Cu and si[J]. Thin Solid Films, 2000,373:64.
7Laurila T, et al. Tantalum carbide and nitride diffusion barriers for Cu metallization [J ] .Microelectronics Engineering, 2001,60:71.
8Lim J W, et al. Improvement of Ta barrier film properties in Cu interconnection by using a non-mass seperated iron beam deposition method[J ] .Materials Transactions, 2002.43(3) :478.
9Briant C L.New applicatiem and novel processing of refractory metal alloys[A]. Proceedings of the 15^# Intermational Plansee Seminar[ C ]. Austria: Reutte, 2001.389.
10Wang D F, et al. Processing and microstructure of Cr - Ta and Cr - Ta -Mo composites reinforced by the Cr2Ta laves phase[A] .16^# Annual Conference on Fossil Energy Materials [C].USA:TN, 2002.4.