芯片封装技术介绍

Introduction of the Chip Package Technology

微电子技术的飞速发展也同时推动了新型芯片封装技术的研究和开发。本文主要介绍了几种芯片封装技术的特点,并对未来的发展趋势及方向进行了初步分析。

The rapid development of microelectronic technology has been giving impetus to the development ofnew chip package technology. Characteristics of several chip package technology are introduced in the paper. The up-to-date trends are discussed and the future research directions are suggested.