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Novel technology of electroless Ni-W-P on plastics and its interface behavior 被引量:1

Novel technology of electroless Ni-W-P on plastics and its interface behavior
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摘要 The electroless Ni-W-P coatings on polyoxymethylene(POM) were prepared. The POM was pretreated by hot spraying Al powder on it. Before the electroless Ni-W-P deposition, the POM with Al coating was flash plated in alkaline bath. The mechanism of Ni-W-P deposition was studied and the technology was optimized. The XRD analysis shows that the "as-deposited" Ni-W-P plating has mixed crystalline structure. The hardness value of deposits is more than HV700. The abrasion resistance of deposits is six times more than that of POM. Bending test was used to determine the cohesion between the deposits and the substrates. SEM was used to study the behavior of surface abrasion and interface bonding condition. The reason for the excellent cohesion was interpreted.
出处 《中国有色金属学会会刊:英文版》 CSCD 2004年第z1期136-139,共4页 Transactions of Nonferrous Metals Society of China
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  • 1[1]Oh K W, Kim D J, Kim S H. Improved adhesion property and electromagnetic interference shielding effectiveness of electroless Cu-plated layer on polycethylene terephthalate by plasma[J]. J Appl Polym Sci,2002, 84: 1369 - 1379.
  • 2[2]Kuzmik J J. Electroless Plating: Fundamentals and Applications [M]. New York: Noyes Publishers,1990.
  • 3[3]Yarygin V I, Mironov V S, Soloyev N P, et al. Synthesis and investigation by means of electron energy loss spectroscopy of metal replicas fabricated from nuclear microfilters[J]. Nuclear Instrum Methods Phys Res B, 2001, 85: 228- 234.
  • 4[4]Keong K G, Sba W, Malinov S. Crystallisation kinetics and phase transformation behaviour of electroless nickel-phosphorus deposits with high phosphorus content[J]. Alloys Compd. 2002, 334:192 - 199.
  • 5[5]Rohan J F, O'Riordan G, Boardman J. Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics application[J]. Appl Surf Sci, 2002, 185: 289-297.
  • 6[6]Tay F E H, Haider E A. Laser sintered rapid tools with improved surface finish and strength using plating technology[J]. J Mater Process Technol, 2002, 121:318-322.
  • 7[7]Straffelini G, Colombo D, Molinari A. Surface durability of electroless Ni-P composite deposits [J]. Wear,1999, 236(1-2): 179-188.
  • 8[8]Sankara Narayanan T S N, Krishnaveni K, Seshadri S K. Electroless Ni-P/Ni-B duplex coatings: preparation and evaluation of microhardness, wear and corrosion resistance [J]. Materials Chemistry and Physics,2003, 82(3): 771 - 779.
  • 9[9]Kurowski A, Schultze J W, Staikov G. Initial stages of Ni-P electrodeposition: growth morphology and composition of deposits [J]. Electrochemistry Communications, 2002, 4(7): 565 - 569.
  • 10[10]Unal H, Mimaroglu A. Friction and wear behaviour of unfilled engineering thermoplastics [J]. Materials and Design, 2003, 24(3): 183 - 187.

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