一种基于铝丝键合工艺的半桥型电力电子集成模块的研制

Research and Design of a Half-bridge Integrated Power Electronics Module Based on Wire-bond Technology

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摘要设计了基于铝丝键合工艺的半桥型电力电子集成模块,对模块的热性能进行了仿真分析,并对模块内存在的高频环流所引起的电磁干扰进行了分析,给出了相应的实验结果.

作者王哲曾翔君张永锋杨旭王兆安

出处《电气传动》北大核心 2004年第z1期162-165,共4页 Electric Drive

关键词电力电子集成电磁干扰

参考文献5

1[1]J.D.Van Wyk, Fred C.Lee. Power Electronics Technology at the Down of the new Millennium-Status and Future, Power Electronics Specialists Conference, 1999,PESC99.30th Annual IEEE, 1999,1: 3-12
2[2]F.C. Lee, Dengming Peng. Power Electronics Building Block and System Intergration. Power Electronics and Motion Control Conference,2000,Proceedings,The Third Intergrational, 2000,1:1-8
3[3]F.C. Lee, D. Borojevic, K. Xing, G. Thandi, and H. Zhu,PEBB and System Integration at Virginia Power Electronic Center, Government Microcircuit Application Conference,March 1997
4[4]K. Xing, F.C. Lee, D. Borojevic, Extraction of Parasitics within Wire-Bond IGBT Modules, IEEE Applied Power Electronics Conference, March 1998
5[5]Shihong Park, Jahns, T.M., Applied Power Electronics Conference and Exposition, 2003. APEC '03. Eighteenth Annual IEEE, 2003, 1:126- 131

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2004年第z1期

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