1[4]B.A. Zahn, "Using Design Experiment Simulation Response to Prepict Thermal Performance Limits of the Heatsink Small Outline Package Considering Both Die Bond and Heatsink Soder Voiding, "1998, Proceedings of the 14th IEEE SEMI-THERMTM Symposium:153～158.
2[5]D.C. Montgomery, Design-Expert and Analysis of Experiments ,3d Edition, John Wiley and Sons, 1991:533-538.
3B.A.Zahn.Using Design Experiment Simulation Response to Pre- dict Thermal Performance Limits of the Heat sink Small Outline Package Considering Both Die Bond and Heat sink Solder Void- ing [J].1998,Proceedings of the 14th IEEE SEMI-THERM Sym- posium153-158.
