玻璃晶体键合的探讨
摘要
本文研究了采用键合技术把玻璃和晶体材料有机的结合,并应用于光学器件的制作.特别研究了预处理、退火等工序对键合工艺的影响.结果表明:预处理、退火等工序都是必不可少的步骤.随着退火时间的增加,结合强度显著提高.
出处
《光电子．激光》
EI
CAS
CSCD
北大核心
2004年第z1期65-67,共3页
Journal of Optoelectronics·Laser
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