摘要
微电子技术的飞速发展也同时推动了新型封装材料的研究和开发。本文综述了电子封装用金属基复合材料的研究和发展状况,并以A1/SiCp为重点,分析对比了目前国内外的差距,提出了其未来的发展趋势及方向。
The rapid development of microelectronic technology has been giving impetus to the development of new electronic packaging materials.The progress of metal matrix composites for electronic packaging is sum marized in this paper.Status and progress on A1/ SiCp in the world and China are also reviewed.The up-to -date trends are discussed and the future research directions are suggested.
出处
《电子与封装》
2003年第2期22-25,共4页
Electronics & Packaging
