摘要
栅氧前清洗是栅氧工艺的重要部分,本文介绍二种适用于亚微米/深亚微米的清洗工艺: 采用稀释化学试剂和兆声波清洗的VCS清洗工艺和IMEC清洗工艺。
Pre-gate cleaning is important to gate oxide quality .This paper introduce two cleaning way which used in submicron /deep-submicron process: VCS cleaning and IMEC cleaning .Diluted chemical and Megasonic are used in two cleaning.
出处
《电子与封装》
2003年第3期36-39,共4页
Electronics & Packaging
关键词
清洗
兆声
颗粒
ZETA电势
Cleaning
Megasonic
Particle
ZETA potential