摘要
BGA是现代组装技术的新概念,它的出现促进SMT(表面贴装技术)与SMD(表面贴装器件)的发展和革新,并将成为高密度、高性能、多功能及高I/O数封装的最佳选择。本文简要介绍了BGA的概念、发展现状、应用情况及一些生产中应用的检测方法等,并讨论了BGA的返修工艺。
EGA is a new concept of contemporary assembly technology .BGA has developed and innovated the SMT/SMD since it was appered. It is believed that BGA will be the best choice of the IC with density, high performance, multiple function and high I/Os. This paper simply introduces the things of the BGA concept, development ,application and some test methods in the assembly process of ball grid array packaging component, then describes the rework process for BGA.
出处
《电子与封装》
2003年第5期17-20,12,共5页
Electronics & Packaging
