摘要
形式验证存在状态爆炸的问题,特别是软硬件的协同验证难以解决.为此研究了片上系统的协同形式验证问题,给出了一种高效的协同形式验证环境Co-Formal,用于从行为级到具体实现级的软硬件协同形式验证.以一个实际的硬件系统验证了该环境的可用性.
Formal verification has attracted great interests in recent years. But the real world system is too complex to be verified directly by symbolic model checking because of state explosion. Another difficulty in validation of system on chip (SoC) is how to coverify of HW/SW. This paper is focused on the coformal verification for SoC. It presented an effective formal coverification environment CoFormal. In this environment, we can coverify a system at behavior level and implementation level. A real circuit system was verified to illustrate the usage of this environment.
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
2003年第z1期143-146,151,共5页
Journal of Shanghai Jiaotong University
基金
美国国家科学基金(5978EastAsiaandPacificProgram-9602485)
教育部博士点基金资助项目
关键词
协同形式验证环境
模型检查
片上系统
formal co-verification environment
model checking
system on chip(SoC)