湿热对高聚物封装测量性能的影响研究

Research of the hygro-thermal induced effect of the performance test for the polymeric packaging material

本文通过潮湿和温度对用应变片测量高聚物封装的机械性能的测试精度的影响的分析 ,给出了一种通过补偿提高测量精度的方法。本文还利用有限元方法仿真了高聚物受湿热作用的应力分布。

In this paper,the hygro thermal induced effect of the performance test for the polymeric packaging material is discussed. A modified retrieve testing method is given to increase the measure precision.Finally,this paper gives a FEM simulation of the polymeric packaging material performance test.