摘要
分别介绍了国内外X射线检测法、超声波检测法以及涡电流检测法第三种无损检测法在垂直Bridgman晶体生长中的应用,讨论了其各自的优缺点。
The application of non-destructive technology in semiconductor vertical Bridgman growth is introduct-
ed. Three methods are mentioned, which are X-ray radiography,ultrasonic and eddy-current techniques. Further-
more,the advantages and shortcomings of them are discussed respectively.
出处
《仪器仪表学报》
EI
CAS
CSCD
北大核心
2003年第z2期290-294,共4页
Chinese Journal of Scientific Instrument
基金
国家自然科学基金(No.50276036)
