功率半导体器件封装技术的新趋势

New Trends in Power Semiconductor Packaging Technology

SKiiP功率半导体器件的封装技术指将DCB陶瓷基片和散热器直接热压接构成,因此可以去掉铜底板。这使得该技术在可靠性和结温方面具有内在的优势。两种新的功率模块系列产品利用这项技术,把压力连接的设想延伸到辅助连接件,即用一个弹簧来连接。智能部件的集成使得将分立的功率系统安装在一个外壳中成为可能。新型模块利用了新一代沟槽型元胞结构IGBT芯片的通流能力。

The SKiiP-power semiconductor packaging technology comprises a direct thermal pressure contact between DCB ceramic and the heatsink and therefore the copper baseplate is eliminated. This leads to an inherent advantage in reliability and junction temperature. Two new power module families take adrantage of this technology and extend the pressure contact idea to the auxiliary connectors, which are contacted by using a spring. The integration of intelligent components makes a complete power subsystem solution ...