摘要
Polymers were successfully used in the packaging of waveguide-based photonic components in the area of fiber-to-waveguide coupling, waveguide die attachment, strain relief, and waveguide encapsulation. The application results of these polymers were described in this paper.
Polymers were successfully used in the packaging of waveguide-based photonic components in the area of fiber-to-waveguide coupling, waveguide die attachment, strain relief, and waveguide encapsulation. The application results of these polymers were described in this paper.
出处
《光学学报》
EI
CAS
CSCD
北大核心
2003年第S1期177-178,共2页
Acta Optica Sinica
