期刊文献+

埋入式电阻工艺开发 被引量:3

Engineering Development of Enbedded Resistors
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摘要 前言 随着电子产品技术的发展,线路板制造中的新技术也不断出现,如:积成式多层印制线路板(Build-Up Multiplayer Board)、导电胶代替金属导通孔印制线路板(B2it)、高密度挠性板、刚-挠性印制线路板、球栅阵列封装(BGA)的广泛应用,发展了超细线条制造技术、微导通孔技术、高纵横比的孔化技术.
作者 丁万春 施忠
机构地区 上海美维
出处 《印制电路信息》 2002年第7期36-44,共9页 Printed Circuit Information
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参考文献7

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  • 2[4]Richard W.Carpent and Edward J.Rearch JR.,"New Embedded Resistor Materials:High Tolerance and High Resistivity" , 1997 Electronic Components and Technology Conference, S02-3-1-S02-3-4
  • 3[5]Heinz BleiweiB, Eddy Roelants, "The Innovative SIMOV Technology" , Future Circuits International, p153~ 159
  • 4[6]Allison Y. Xiao, Quinn K.Tong, and Ann C.Savoca, Polymer Thick Film Material for Intergral Resistors, 1999 Electronic Component and Technology Conference,p88~92
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  • 6[9]Glen Walther, "Tolerance Analysis of Ohmega-Ply Resistors in Multilayer PWB Design" , Circuitree, Mar. 2001, 64
  • 7[10]William J. Borland, Saul Ferguson, Embedded Passive Components in Printed Wiring Boards:A Technology Review, Circuitree, Mar. 2001, 94

同被引文献16

  • 1李春甫.网印内埋电阻——网印与电子技术[J].网印工业,2007(4):10-14. 被引量:4
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  • 3Min G. Embedded passive resistors challenges and opportunities for conducting polymers[J]. Synthetic Metals, 2005, 153(1/3):49-52.
  • 4Lee H F, Chan C Y, Tang C S. Embedding capacitors and resistors into printed circuit boards using a sequential lamination technique[J]. J Mater Process Technol, 2008, 207(1/3):72-88.
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  • 7Lai L 17, Zeng W J, Fu X Z, et al. Annealing effect on the electrical properties and microstructure of embedded Ni-Cr thin film resistor[J] 2012, 538:125-130.
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