印制板上形成凸块的倒芯片安装技术

Bump for Flip chip Attach Technology Formed on the PWB

下载PDF

导出

摘要该文概述了在印制板(PWB)上形成倒芯片安装用的凸块的方法和工艺条件,并进行可靠性试验和评价,确认了Boss B^2it 技术可以实现低成本倒芯片安装。

作者蔡积庆

出处《印制电路信息》 2002年第11期54-57,共4页 Printed Circuit Information

关键词倒芯片安装凸块 BOSS B2it技术

参考文献3

1[2]T.Motomura et.al. "New Flip Chip Attach Technology by Using Silver paste Bumps",Proc.9-th IMC.pp.86-91, April, Omiya, 1996
2[3]F.Veuo et al., New Flip Chip Attach Technology for Fine pitch Interconnections Vsinq, Electroplated Copper Bumps Formed on a Substrate,proc, I-nd IEMT/EMC, Symposium, pp-.364-368, April, Omiya, 1998
3[4]H.Hirai et al., Developments of Flip chip Attach Technology Using Ag paste Bump which Formed On PWB Electrodes, proc. Internationel Symposium On Electronic Materials and Packaging,pp.1-6, November, Hong Kong, 2000

印制电路信息

2002年第11期

内容加载中请稍等...