Ni含量对CuCr25合金组织与性能的影响

Effects of Ni content on microstructure and properties of CuCr25 contact materials

采用真空感应熔炼法获得不同Ni含量的CuCr2 5合金。通过观察其显微组织和测量其性能得如下结果 :随Ni含量的增加 ,合金的Cr相由树枝晶转变为节点状晶粒 ,并且得到明显细化 ;合金的电导率大幅度下降 ,但是Ni含量小于 0 .5 % ,电导率大于 2 0MS/m ,相当常规CuCr5 0的性能 ;Ni含量对该合金的耐电压强度影响不大。

CuCr25 alloys containing different Ni content were prepared by vacuum induction melting (VIM). The microstructure and properties were tested. The results shows that with the increase of Ni content in CuCr25 alloys, the Cr phase transformed from developed dendrite into nodular grains and was refined drastically; the electrical conductivity decrease significantly, but still reach the level of conventional CuCr50, when the Ni content is below 0.5%; the Ni content has little influence on their breakdown strength