摘要
过去十年间MMIC芯片及其以它为核心的MMCM技术始终保持着跳跃前进的发展态势。对该段历史进行简要的回顾 ,并对与三A目标紧密相关的若干热点论题一一作出评述。这些论题依次为功率MMIC及其模块、多功能MMIC、芯片尺寸缩减和 3DMMIC及MMCM。
During the past ten years, the technology of MMIC chips and modules has been developped in high speed. This paper reviews the history of this technology development and discusses some topics of general interest which are closely related to 3A (available, applicable and affordable) goals of MMIC chips and modules. They are including power MMICs, multifunction MMICs, chip size reduction, 3D MMICs and MMCMs in sequence.
出处
《电子机械工程》
2001年第5期2-7,17,共7页
Electro-Mechanical Engineering
