摘要
随着电磁污染的日益严重以及塑料在电子产品封装上的广泛应用,对电子产品进行电磁屏蔽设计已成为必然趋势。本文采用磁控溅射的方法在PET塑料基底上沉积多种膜系的金属屏蔽膜层,并对金属膜层的制备工艺进行了研究,最后采用波导法对金属膜层的屏蔽效能进行测试。研究表明,采用Cu/1Cr18Ni9Ti双层金属膜层结构,可以获得良好的表面性能以及结合力,结合力达到500kPa以上;总厚度仅为764nm的Cu/1Cr18Ni9Ti在2.5GHz时可获得60dB以上的屏蔽效能;在总厚度相等的情况下,双面金属层比单面金属层具有更高的效果。
A variety of multi-layered metallic coatings were deposited by magnetron sputtering,for the purpose of electromagnetic shielding(EM)of electronics device,on polyethylene terephthalate(PET)substrates.The coatings were characterized with scanning electron microscopy(SEM)and its EM shielding was evaluated with a lab-made microwave setup.The results show that the films work well.We suggest that the copper/stainless steel(Cu/1Cr18Ni9Ti)bi-layered coating works best in meeting the commercial requirements of EM sh...
出处
《真空科学与技术学报》
EI
CAS
CSCD
北大核心
2008年第S1期98-101,共4页
Chinese Journal of Vacuum Science and Technology
关键词
磁控溅射
屏蔽效能
电磁屏蔽
塑料金属化
Magnetron sputtering
Shielding effectiveness
EM shielding
Plastic metallization
