电沉积非晶态Ni-Cu-P合金工艺的研究

Research on Amorphous Ni-Cu-P Alloy Plating

在次磷酸型镀液中加入添加剂,采用不同的电流密度、镀液温度和pH值进行电沉积非晶态Ni-Cu-P合金镀层,并对镀层的形貌、结合力、孔隙率等性能进行比较,获得了最佳电镀工艺。结果表明:采用优化工艺,获得非晶态合金镀层外观光亮、结合力强、耐蚀性好,工艺稳定性好,镀液分散能力好。

An amorphous Ni-Cu-P alloy coating was electrodeposited at different current densities,bath temperatures and pH values by adding some additives in conventional plating solution containing hypophosphite,and the morphology,adhesion,porosity rate of the coating were compared,obtaining an optimal electoplating process. The results show that the optimal process can obtain a bright coating,which is strong in ashesion,good in corrosion resistance,the process is stable,and the throwing power of the plating solution...