摘要
低温共烧陶瓷(LTCC)多层互连基板,具有可内埋无源元件、高频特性优良、IC封装基板、小型化等优点,在军事、宇航、汽车、微波与射频通信等领域得到了广泛应用,其制造技术,是MCM技术中的关键技术。该文介绍了LTCC基板的制造工艺、关键技术及其优化。通过对关键工艺进行优化,获得了一套适合带腔体LTCC多层互连基板制作的工艺参数。并已成功研制出满足T/R组件微波电路性能要求的LTCC多层互连基板。
Low temperature cofired ceramic (LTCC) possesses a great number of advantages. It is used as IC substrate plate where passive devices may be embedded. LTCC is widely used in military, astronavigation, automobile, microwave and radio frequency communication. This paper deals with the manufacture and the process optimization of LTCC.
出处
《电子科技大学学报》
EI
CAS
CSCD
北大核心
2008年第S1期50-53,共4页
Journal of University of Electronic Science and Technology of China
关键词
互连电路
低温共烧陶瓷
多层
工艺优化
通孔填充
interconnection circuit
low temperature co-fired ceramic
multilayer
process optimization
via filling
