颗粒增强铝基复合材料热残余应力分析

RESEARCH OF THERMAL RESIDUAL STRESS IN SiC_p/Al COMPOSITES

碳化硅颗粒增强铝基复合材料在高温制备冷却过程中会产生较大的热残余应力场。热残余应力的存在对材料尺寸稳定性有较大影响从而影响到材料在应用中的精度。本文采用XRD测量了复合材料内部残余应力,分析了不同因素对热残余应力的影响。XRD测量结果表明:不规则形颗粒增强SiCp/ZL101复合材料中热残余应力高于近球形SiCp/ZL101复合材料;复合材料中热残余应力随着增强体颗粒粒径的减小而增大;水冷处理后的复合材料中热残余应力最大,空冷次之,炉冷最低。

High residual stress is observed in SiCp/Al composites during cooling process.The thermal residual stress is an important factor for composites dimension stability and precision in application.The thermal residual stress in SiCp/ZL101 composites was measured by XRD,and the effect of different factors was analysed.The results indicate that the stress in irregular SiCp/ZL101 composites is larger than that in spherical SiCp/ZL101 composites.The thermal residual stress was increased with the reduction of partic...