摘要
从器件引脚镀层种类、厚度、焊接参数和焊盘设计等几个方面对小尺寸封装(small outline package,简称SOP)器件焊点可靠性的影响作了分析,给出了提高焊点可靠性的方法,并通过UG软件建立了电路板和SOP焊点的三维有限元模型,进行了SOP器件焊点在近似试验载荷条件下的应力应变三维有限元数值模拟,得出了焊点内部精确的应力应变分布。
The way to improve the reliability of small outline package(SOP) component solder joint is gained by analyzing the factors of the cladding material type of pin,the thickness of pin,the welding parameters and design of pad.The finite element model(FEM) of circuit board and SOP component solder joint is established by UG,combined with strdss-strain three-dimensional finite element numerical simulation of SOP component solder joints under the approximate experimental load,and finally precise inner stress-strai...
出处
《航天制造技术》
2009年第1期14-17,共4页
Aerospace Manufacturing Technology
关键词
SOP器件焊点
焊接可靠性
有限元数值模拟
SOP component solder joint reliability finite element numerical simulation
