新型电子封装Si-Al合金的基础研究

Fundamental Study of Novel Si-Al Electronic Packaging Materials

对传统金属电子封装材料的研究开发现状进行了简单评述。利用喷射沉积成形技术制备了Si-Al(含硅量50%～70%)合金。这种合金具有细小均匀的显微组织,同时具有低热膨胀系数、高热传导率和低密度等特点,加工性能和封装工艺性能良好。

The research and development of the traditional packaging materials is briefly reviewed.In this investigation,Si-Al alloys with 50～70 wt%Si were fabricated by spray forming.The alloys prepared have fine and homogeneous microstructure,and lower thermal expansion coefficient,higher heat conductivity and lower density when compared with the traditional packaging materials.