Pyrex7740玻璃深刻蚀研究

Investigation on Deep Etching of Pyrex 7740 Glass

研究了以TiW/Au为掩膜,在氢氟酸以及氢氟酸加硝酸溶液中Pyrex7740玻璃的湿法深刻蚀现象。实验发现,在氢氟酸中玻璃的刻蚀速率随溶液温度及浓度的升高而升高,室温下纵/横向侧蚀比最小。在氢氟酸中加入少量硝酸后可以提高其刻蚀速率,当硝酸含量为10%时,刻蚀速率可以提高两倍左右。利用上述结果,实现了用一层TiW/Au掩膜制作多种不同深度的玻璃坑槽结构,为玻璃上不同深度沟道制作提供了一种新的方法。

The deep wet etching behaviors of Pyrex 7740 glass with a TiW/Au mask were investigated in HF and HF-HNO3 solutions. It is found that the etching rate in HF solution is increased with increasing of the concentration and temperature of the HF solution and the aspect ratio is the smallest at room temperature. The etching rate can be enhanced by adding little of HNO3 in HF solution and it is increased by two times when the content of HNO3 in HF solution is 10%. By the above results, the multi-depth grooves were obtained on glass using only one layer of TiW/Au mask, which the result provides a new method for making grooves on glass with different depths.