脉冲电镀制备硅基细晶镍铁合金薄膜

Study on Deposition of Fine Ni-Fe Alloy Films on Si Substrate by Pulse Electroplate

应用脉冲电镀法在硅片上制备细晶粒镍铁合金薄膜,对电镀工艺参数与形成的沉积层的微观组织关系进行了探讨。通过改变脉冲电源的电参数来研究其对镀层结构和微观形貌的影响。运用扫描电子显微镜(SEM)和原子力显微镜(AFM)等实验手段对电镀层微观结构进行了观测与分析。研究表明,随着电流密度的增加与脉冲频率的加大,沉积层晶粒明显细化,致密度增大,使镀层质量得到很大的提高。

The fine Ni-Fe alloy films were prepared on Si substrate by electroplate and the relationship of the microstructures of the films with the technological parameters was researched. The parameters related to the pulse power supply were changed to study on the effects of the parameters on the structures and morphologies of the films. The microstructures of the films were investigated by scanning electron microscope and atomic force microscope. The results indicate that the grains of the films are fined and their compatibility is increased with increasing of the current density and frequency. As a result, the quality of the films is improved.