电化学沉积Cu牺牲层工艺用于制备面外运动电热微驱动器

Fabrication of Electro-thermal Actuator Moving Out-of-plane by Electroplating Cu as Sacrificial Layer Technology

用电化学沉积Cu作为牺牲层制备面外运动电热微驱动器的悬空结构,并建立了一种简单、可靠的牺牲层工艺技术。该工艺具有工艺流程简单、牺牲层易获取、释放简单、腐蚀选择性好、结构保存完整等优点。通过退火去除残余应力、使用丙酮和F113进行悬空结构释放等方法改进工艺,可以得到理想的器件。证明电化学沉积Cu是比较好的制备悬空结构的牺牲层工艺。

A cantilever of electro-thermal actuator moved out-of-plane was fabricated by electroplating copper as sacrificial layer and a new technique of preparation of sacrificial layer was established.The technique possesses a simple process and the sacrificial layer is obtained easily and removed quickly.Simultaneously,the etching can be well selected and the perfect structure can remain.After eliminating residual stress by annealing and releasing the cantilever using acetone and F113,the ideal device can be obtained.