基于CPLD的全自动半导体芯片键合机的控制技术

Automatic CMOS Chip Die Bonder Control Technology Based on CPLD

针对传统的半导体芯片键合机的控制板卡逻辑器件多、电路复杂、稳定性差等特点,提出了一种基于CPLD的全自动半导体芯片键合机的控制技术。并在试验板上进行了测试,试验表明新的控制技术完全可以取代原控制板卡的功能,且该方案提高了控制板卡的工作速度,具有电路设计简单、可靠性高和易移植等特点。

According to the characteristic of Traditional CMOS chip die bonder control technology such as a lot of logic devices, complex circuit and feeble stability. we present a new technology based on CPLD.The simulation results show that the new technology can replaced the traditional approach entirely and this new technology reduces the circuit’s runtime and has the the characteristic such as compact circuit design, strong stability and transplant .