摘要
针对生物芯片中广泛应用的高聚物材料,利用其对波长为10.6μm的CO2激光具有良好的吸收性这一特点,对生物芯片储液池进行加工。根据理论分析,提出影响切割表面粗糙度的主要因素在于激光功率P、切割速度Ve和离焦量L,并结合实验数据通过函数拟合得出经验公式,采用CO2激光加工的PCR生物芯片储液池,其切割面粗糙度可达0.05μm,加工速度可达1 m/min,使生物芯片的批量生产和广泛应用向前迈出一大步。
As high polymers have high absorbance of CO2 laser, whose wavelength is 10.6 μm, it is possible to utilize CO2 lasers in the manufacturing of the microchamber of biochips made from high polymers. The theoretical analysis shows that the cutting surface roughness depends on the laser power, cutting velocity and the focus shift. Experimental formula is given on the basis of experimental data and curve fitting. A cutting surface roughness of 0.05 μm can be achieved with CO2 lasers in the processing of cells of biochips. And the cutting velocity is up to 1 m/min, thus benefits greatly to the batch production and widely application of biochips.
出处
《微细加工技术》
EI
2006年第3期18-21,共4页
Microfabrication Technology
基金
国家863项目资助(2004AA404260)
关键词
激光切割
激光功率
切割速度
离焦量
laser cutting
laser power
cutting velocity
focus shift