激光微细熔覆快速原型制备厚膜电容介质膜的研究

Study on Dielectric Film Fabricated by Laser Micro-cladding and Rapid Prototype

传统上厚膜电容的制备由于采用了丝网技术、烧结工艺、有限的匹配温度特性材料,使得要实现高容量、低损耗、高频性就必须同时改变材料的成分、制备工艺和技术,这是无法同时达到的。而采用激光微细熔覆快速原型制造技术,不需要高温烧结和掩模的制备,在不改变电极膜特性的情况下直接制备了适应高容量、低损耗和高频应用的介质膜。同时,消除了原有技术通过多次印刷和增加厚度来减少针孔的弊端,以及高温烧结带来的电极材料和介质材料成分的扩散,利用CAD/CAM系统可灵活地制备所设计的图形和尺寸,实现了元件小型化、轻薄化的制造。

Traditionally, thick-film capacitor is fabricated by screen printing, high-temperature sintering and limited matched temperature characteristic materials. Composition of materials, processing and technologies must be changed all together to get high capacitance, low dissipation and high frequency, but there is no method to realize. In this paper, a technique of laser micro-cladding and rapid prototype was applied. In this technique, there are no mask and high-temperature sintering process, the dielectric film can directly be fabricated to apply for high capacitance, low dissipation and high frequency when electrode materials are changed. At the same time, it eliminates shortcomings of conventional technologies such as decreasing pores by printing many times and increasing thickness, and composition diffusion between electrode materials and dielectric materials by high-temperature sintering. Computer aided design and computer aided manufacture (CAD/CAM) system is applied to flexibly design patterns and sizes so that the fabrication of the miniaturized and lightweight components is realized.