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氧化-球磨-还原法制备超细弥散分布钨铜复合粉末 被引量:2

W-Cu composite with near full density and high thermal conductivity produced by thermal-mechanical method
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摘要 在对钨铜复合粉末进行TGA-DTA分析、XRD物相分析和SEM观察分析的基础上,对氧化物粉末共还原工艺进行了改进,对比机械合金化直接制备钨铜复合材料工艺表明:对钨铜氧化物粉末短时快速球磨约3~10h后,能快速细化氧化物粉末粒度(<1μm),降低粉末还原温度(约600℃),可制备高分散的超细钨铜复合粉末(<1μm);在较低的烧结温度(1200℃)下可得到相对密度为99.5%,热导率为205W·m^(-1)·K^(-1)的钨铜烧结制品。 The method of Co-Reduction of W-Cu oxide powder are improved by analyzing the TGA-DTA, XRD and SEM of the oxide powder. The results show that after oxidation at 602.5 ℃, and a quick MA of only 3 h, the particle size of W-Cu composite powder after reduction would he less than 1 μm, the tungsten phase and copper phase are uniformly mixed, the relative density and the thermal conductivity of final product are 99.5% and 210 W·m^(-1)·K^(-1) after sintering at 1200 ℃ for 1 h.
出处 《粉末冶金材料科学与工程》 EI 2003年第3期242-246,共5页 Materials Science and Engineering of Powder Metallurgy
关键词 钨铜复合材料 热导率 相对密度 W-Cu composite thermal conductivity relative density
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