摘要
采用自主研制的1 000W半导体激光器,对2024和7075铝合金薄板进行了焊接。论文分析了不同工艺参数对于铝合金焊缝宏观成型和微观组织的影响。2024铝合金焊缝的沉淀析出物尺寸明显变小。试验研究表明焊接过程比较稳定,焊缝成型良好,得出大功率半导体激光器适合于薄铝板的焊接。
High power diode laser welding aluminum alloy 2024 and 7075 plate is researched.The microstructures of the welding seams are given.The size of precipitates of 2024(aging) in welding seam seems smaller than that in the base metal.The welding processing is steady and the surface of welding seam is smoothness.It can be concluded that high power diode laser is suitable for welding thin plate.
出处
《红外与激光工程》
EI
CSCD
北大核心
2007年第z1期326-328,共3页
Infrared and Laser Engineering
基金
科技部国际合作项目(2002AADF3101)
国家自然科学基金(60407009)
北京市自然科学基金(4042007)
