高热可靠性电子器件热变形模拟

SIMULATION OF THERMAL DEFORMATION FOR ELECTRONIC DEVICES OF HIGH THERMAL RELIABILITY

电子器件热变形的模拟对于提高器件的热可靠性有着重要意义 .以一种可靠性要求很高的电子器件——火箭点火用固态继电器作为研究对象 ,采用三维有限元程序对固体继电器工作时内部的热变形进行计算和分析 。

Simulation of thermal deformation is significant to enhance thermal reliability of electronic devices. A type of high reliability required electronic component solid state relay which is used for ignition of rocket is chosen as research object. Three dimensional finite elecment program is utilized to simulate thermal deformation of solid state relay under working condition. The result is consistent with experimental result.