Cr元素对Diamond/Cu复合材料界面结构及热导性能的影响

Influences of Cr Element on Interface Structures and Thermal Properties of Diamond/Cu Composites

采用预制件制备,压力浸渗金属工艺制备Diamond/Cu复合材料,分析了Cu基体合金化及金刚石颗粒表面金属化情况下,Cr元素对复合材料界面结构和热性能的影响。结果表明,Diamond/Cu-Cr复合材料中金刚石与Cu-Cr合金界面结合良好,Cr元素在界面处发生富集并与金刚石反应生成Cr3C2,其界面结构为金刚石-Cr3C2-富Cr的Cu-Cr合金层-Cu-Cr基体,复合材料的热导率达到520W.m-.1K-1;Diamond-Cr/Cu复合材料中金刚石表面金属化Cr层在熔渗过程中与Cu互扩散,促进界面结合,形成金刚石-Cr3C2层-纯Cr层-Cu-Cr互扩散层-Cu的界面结构。与Diamond/Cu-Cr复合材料相比界面处增加了Cr层,材料的热导率仅为279W.m-1.K-1,但均高于Diamond/Cu复合材料的热导率。

Diamond/Cu composites were fabricated by pressure infiltration process.Influences of Cr element on interface structures and thermal properties of the Diamond Cu composites were analyzed.It was found that in Diamond/Cu-Cr composites,Cr accumulated on the interface and reacted with Diamond to form Cr3C2,which promoted the interfacial bonding.The interface structure formed between Diamond and Cu-Cr alloy was Diamond-Cr3C2 with rich Cr Cu-Cr alloy with Cu-Cr alloy sequentially.And the thermal conductivity is 52...