摘要
在低软化点钙硼硅玻璃(LG)[r(Ca:Si)>1]中添加高软化点钙硼硅玻璃(HG)[r(Ca:Si)<1],经低温烧结制备了钙硼硅(CaO-B2O3-SiO2,CBS)LTCC材料(又称CBS微晶玻璃)。利用XRD和SEM,研究了HG的添加量及烧成温度对钙硼硅LTCC材料的物相和微观结构的影响。结果表明,HG玻璃的引入有效提高了LG的烧结性能及拓宽了烧结范围,且有效降低了该材料的相对介电常数。w(HG)为20%时,CBS微晶玻璃能够在850～910℃烧结致密;在1MHz测试频率下,相对介电常数小于7.25,介质损耗小于2×10–3。
Calcium borosilicate (CaO-B2O3-SiO2, CBS) system LTCC materials were prepared by doping high-melting-point CBS glass (HG) into low-melting-point CBS glass (LG). The effects of addition of HG and sintering temperature on microstructure and dielectric properties of CBS system LTCC material were studied by XRD and SEM. The results show that the LG sintering temperature and singtering range increase when doped HG, and the relative permittivity decreases. When added 20% of w(HG), composite glass-ceramics are den...
出处
《电子元件与材料》
CAS
CSCD
北大核心
2010年第6期34-37,共4页
Electronic Components And Materials
基金
国家"863"计划资助项目(No.2007AA03Z455)
关键词
LTCC
钙硼硅玻璃
微晶玻璃
致密化
LTCC
calcium borosilicate glass
glass-ceramics
densification
