高速串行总线RapidIO与PCI Express协议分析比较

Analysis and Comparison of High Serial Bus RapidIO and PCI Express Protocol

随着新一代嵌入式系统对数据传输能力要求的提高,高速串行总线有着越来越广泛的应用,RapidIO和PCI Express(亦称PCIe)是常见的选择。通过对这两种协议在整体工作机制及其特点、分层模型、拓扑结构、服务质量等方面的分析比较,为嵌入式系统设计中高速串行总线的选择提供参考。

With the improving requirement of data transporting ability of the new generation of high performance embedded system,the high serial bus,two of which choices are RapidIO and PCI Express ( also called PCIe) ,is used wider and wider. The paper provides reference to the choice of high serial bus of embedded system design through analysis and comparison of the two protocols in some aspects,such as whole work mechanism and their characteristics,layer model,topological structure,service quality and so on.