摘要
本文对几种在塑封集成电路封装中常用导电胶的前固化工艺进行了比较与探索,得出了一些具有实际意义的温度固化工艺曲线。
Several Kinds of precure processes in plastic packaging IC are compared and studied in this article.Moreover,the available process curves of temperature cure are also offered.
出处
《电子与封装》
2002年第6期17-19,共3页
Electronics & Packaging
