新一代BGA封装技术

Next-generation BGA Techndogy

本文主要介绍了 BGA 封装技术的一个分支——新一代 BGA 封装技术:略大于 IC 的载体 BGA(SLICC BGA),缩小型 BGA(m MGA),微型 BGA(μBGA),芯片尺寸封装(CSP),超级焊球阵列封装(Super BGA),混合 BGA 和现场可编程互连器件(FPID)BGA 封装技术。此类技术封装的电路特点是体积更小、成本低、优良的散热性能和电性能。

Next-generation BGA such as Slightly Larger than IC Carrier(SLICC),Mini Ball Grid Ar- ray(mBGA),Micro Ball Grid Array(μBGA),Chip Scale Package(CSP),Super Ball Grid Array(Super BGA)and Field Programmable Interconnect Device(FPID)have mainly been presented in this article. Even smaller in dimentions.Lower in cost,much better in electrical performance and in heat sink are some of their characteristics.